IC Packaging Characterization Engineer

Santa Clara Valley (Cupertino), California, United States
Hardware

Summary

Posted:
Role Number:200448112
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for precision to work towards an extraordinary result? We are looking for a dedicated and hardworking IC Packaging Characterization Engineer to join our team. As part of the Packaging team, you will focus on the characterization of Integrated Circuits (IC) packages and related materials. You will also be responsible for developing methodologies of IC packaging characterization, and trouble-shooting IC packaging-related yield and reliability issues.

Key Qualifications

  • Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc.
  • Proven capability of setting up equipment and data acquisition systems.
  • Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is helpful.
  • Knowledge of the Integrated Circuit packaging process, reliability, qualification requirements, and key materials is a plus.
  • Excellent written and verbal communication skills with ability to present ideas, data, and plans with high confidence at team meetings.

Description

- Characterizing component packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing. - Characterizing key packaging materials and supervising material characterization activities at suppliers. - Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test. - Working on trouble-shooting activities of packaging-related failures.

Education & Experience

- BS and 3+ years of relevant industry experience.

Additional Requirements

Pay & Benefits